Mersen’s air cooled heat sinks come in a variety of sizes and materials. Our Fabfin® design incorporates our patented swaging technology so that the fins are mechanically secured to the base plate, eliminating the need for less efficient bonding or gluing agents.
Mersen will help you maximize performance, safety & reliability with customised cooling solutions, services & support.
Mersen integrates its extensive cooling expertise and patented heat sink technology into semiconductor applications to make them more efficient, reliable and profitable.
Mersen’s engineering team will help you find innovative cooling solutions, work with you to design the performance boundaries and even simulate your Application before a prototype is built.
Our unique knowledge of air, phase change and liquid cooled heat sinks enables Mersen to help you find the right thermal protection solution for your application.
High Performance air cooled heat sink
Heatpipe assembly heat sink
Embedded heat pipe air cooled heat sink
By incorporating heat pipes onto the surface of an air cooled heat sink, a high concentration of heat from power electronics can be spread out over a larger area very quickly. This technique can greatly improve the cooling performance of the heat sink on applications such as SiC and Power Amplifier.
Liquid cooled cold plate heat sink
Mersen has mastered vacuum brazing technology to achieve guaranteed leak proof liquid cooled cold plates. The cold plates are robust and corrosion resistant, offering superior thermal performance. Both embedded tube and vacuum brazed cold plate designs are available.